Intel Xeon E3-1230 v3 E3 1230 v3 E3 1230v3 3.3 GHz Used Quad-Core Eight-Thread CPUs Processor 8M 80W LGA 1150 IC chipset Origina

General information

Type

Market segment

Server

Family

Model number

E3-1230 v3

CPU part numbers

• CM8064601467202is an OEM/tray microprocessor

• BX80646E31230V3is a boxed microprocessor

Frequency

3300 MHz

Maximum turbo frequency

3700 MHz (1 core)
3500 MHz (4 colors)

Bus speed

5 GT/s DMI

Package

1150-land Flip-Chip Land Grid Array

Socket

Socket 1150 / H3 / LGA1150

Size

1.48 “x 1.48” / 3.75cm x 3.75cm

Introduction date

Price at introduction

$240 (OEM)
$250 (box)

S-spec numbers

Architecture / Microarchitecture

Microarchitecture

Haswell

Platform

Denlow

Processor core

Haswell LGA1150

Core stepping

C0 (SR153)

Manufacturing process

0.022 micron

Data width

64 bit

The number of CPU cores

4

The number of threads

8

Floating Point Unit

Integrated

Level 1 cache size

4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches

Level 2 cache size

4 x 256 KB 8-way set associative caches

Level 3 cache size

8 MB 16-way set associative shared cache

Physical memory

32 GB

Multiprocessing

Uniprocessor

Features

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 SSE4.2 / Streaming SIMD Extensions 4

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• AVX2 / Advanced Vector Extensions 2.0

• BMI / BMI1 BMI2 / Bit Manipulation instructions

• F16C / 16-bit Floating-Point conversion instructions

• FMA3 / 3-operand Fused Multiply-Add instructions

• TSX / Transactional Synchronization Extensions

• EM64T / Extended Memory 64 technology / Intel 64

• NX / XD / Execute disable bit

• HT / Hyper-Threading technology

• TBT 2.0 / Turbo Boost technology 2.0

• VT-x / Virtualization technology

• VT-d / Virtualization for directed I/O

• TXT / Trusted Execution technology

Low power features

• Core C1/C1E, C3 and C6 states

• Package C1/C1E, C3 and C6 states

• Enhanced SpeedStep technology

Integrated peripherals / components

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
DIMMs per channel: up to 2
Maximum memory bandwidth (GB/s): 25.6
ECC supported: Yes

Other peripherals

• Direct Media Interface 2.0

• PCI Express 3.0 interface

Electrical / Thermal parameters

Thermal Design Power

80 Watt